COMPETENCIES
Surface Mount Technology
- Prototype building, high-mix low-volume production
- Placement of the smallest chip components (0.6mm x 0.3mm), up to large QFP IC (0.3mm pitch) and BGA (0.5mm pitch) on rigid and flexible PCB with maximum board size up to 460 x 400mm
- Assembly of components on single or double sides of the board with solder paste and/or adhesive bonding
- Reliable non-clean or water-based cleaning process for conventional SnPb and RoHS (Lead-free) compliant soldering
Through Hole Technology
- Manual component mounting
- Semi-automatic assembling
- Manual component soldering
- In-Line wave soldering system
Cable Assembly
- Semi-Rigid RF Cable assembly
- Flexible RF Cable Cable assembly
- Manufacturing according to customer specifications
Box Build Products
- Complete Unit Assembly, including:
- PCBA's
- Cables
- Mechanical components